Photovoltaics Silicon Cut med Diamond Loop Wire Saw

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När diamanttrådsågslinga skär kiselmaterialen, kunde Loop Diamond Wire bearbetas under hög hastighet och skärningen inte lätt att producera chatter med bättre ytfinish. För kiselskärning är ytfinishen mellan 0,328-0,6 μm, den totala tjockleksvariationen är cirka 10 μm.