Photovoltaics Silicon Cut med Diamond Loop Wire Saw

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Når diamantwiresagløkke kutter silisiummaterialene, kan Loop Diamond Wire bearbeides under høy hastighet, og skjæringen er ikke lett å produsere skravling med bedre overflatebehandling. For silisiumskjæring er overflatefinishen mellom 0,328-0,6μm, den totale tykkelsesvariasjonen er ca 10μm.